| 摘要 |
A heat dissipating device comprises a heat sink which has a plurality of fins 22, 23 and a central area 21 and is formed by stamping and then bending a metal plate. The fins 22, 23 have slits 25 there between. A mounting plate 30 which has a fan 31 is also mounted on the heat sink. The heat sink may have holes 24 for engaging with the mounting plate 30 by means of fasteners 32. The central area 21 of the heat sink may have a plurality of holes or slots. The fins 22, 23 may have different heights. The heat sink may have at least one outwardly extending ear having a hole. There is also disclosed a method of manufacturing a heat sink by stamping a metal plate in which the fins surround a central area of the heat sink. The heat dissipating device may be used for dissipating heat from a central processing unit (CPU). |
