Process of forming electrode of chip electronic part

摘要

An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part. The chip-like electronic part is held by a holder with a first plurality of side surfaces being exposed and facing a paste base on which a streak of conductive material is placed. The holder and paste base are brought together so that the first band of conductive material is applied to the first plurality of side surfaces. The chip-like electronic part is then repositioned with its remaining side surfaces being exposed and facing a paste base and the second band of conductive material is applied to those side surfaces.