发明名称 LASER BEAM PROCESSING METHOD AND ITS APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam processing method in which both of an ablation and heat transmission effect are compatible with each other and a high- precision fine processing is also attainable, and its apparatus. SOLUTION: A YAG laser 10 for irradiating a laser beam to a processed object for pre-heating and a titanium sapphire laser (femto-second laser) 11 for processing a pre-heated processed object by an irradiation of the laser beam are provided. Namely, the processed object is first pre-heated by the YAG laser 10 and then processed by the titanium sapphire laser (femto-second laser) 11. Any residues are not existed around a processed bottom portion, and further, heat damage for a periphery of the processed portion is restrained so that a sharp processed profile is obtained.</p>
申请公布号 JP2001212685(A) 申请公布日期 2001.08.07
申请号 JP20000027806 申请日期 2000.02.04
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI;UMETSU KAZUNARI;NAKAO HITOSHI
分类号 B23K26/00;B23K26/06;B23K26/38;H01S3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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