SURFACE TREATED COPPER FOIL, METHOD FOR MANUFACTURING THE SURFACE TREATED COPPER FOIL AND COPPER LAMINATED SHEET USING THE SURFACE TREATED COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide a surface treated copper foil capable of securing the deteriorating rate of hydrochloric acid resistance of 10% or less by a copper foil circuit with a width of 0.2 mm and moreover excellent in moisture resistance, heat resistance and long term preservative stability by bringing out the effect of a silane coupling agent used for copper foil having a galvanized or galvannealed rust preventive layer to the maximum. SOLUTION: This surface treated copper foil is obtained by subjecting the surface of copper foil to roughening treatment and rust preventing, treatment, and the rust preventing treatment is obtained, e.g. by forming surface treated copper foil for a printed circuit board obtained by forming a galvanized or galvannealed rust preventive layer on the surface of copper foil, forming an electrolytic chromate layer on the surface of the rust preventive plated layer, forming a silane coupling agent adsorption layer on the electrolytic chromate layer, controlling the temperature of the electrolytic copper itself to the range of 105 to 200 deg.C and drying the same for 2 to 6 sec.