CORROSION INHIBITING PROTECTIVE LAYER OF ALUMINUM ALLOY METALLIZED LAYER AND PRODUCING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a film preventing the corrosion of a metallized layer of a base in the case a semiconductor electronic device is placed in a wet environment. SOLUTION: This invention provides a method for producing an inhibiting protective layer for corrosion generated by the moisture of an aluminum alloy metallized layer 1 particularly in a semiconductor electronic device. This invention includes a chemical treatment for the metallized layer 1 at least by 2 stages using a mixture of concentrated nitric acid and a small amount of phosphoric acid for the purpose of forming a thin corrosion inhibiting protective layer. Alternatively, the immersion of an electronic device into a mixture of a polar organic solvent and a phosphate reaction agent such as a small amount of phosphoric acid (H3PO4) or the phosphate derivative thereof such as orthophosphoric acid or R-HxPOy (wherein, R is an alkaline type ionic group or an alkuyl group) for at least one time is included. A thin film 3 is deposited on a thin natural hydrated aluminum oxide thin layer 2.