发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To efficiently enclose a reaction gas near a plasma generating region in a plasma treatment apparatus with using a rotary electrode. SOLUTION: In the plasma treatment apparatus in which a roll shape rotary electrode 1 is arranged in a reaction container 10, by imparting high frequency or DC power to the rotary electrode 1, plasma 4 is generated near the rotary electrode 1, at least one kind of the plasma treatments is conducted with using the plasma 4 which treatment is selected from among thin film deposition on a substrate 2 arranged facing a rotary electrode 1 peripheral face, the treatment of the substrate 2 and cleaning of the rotary electrode 1 peripheral face, the space near the substrate 2 is demarcated so as to form treatment spaces 20A, 20B by the peripheral face of the rotary electrode 1, the wall face of the reactor container 10, two shut off members 5, 6 arranged between these, the shut off members 5, 6 include rollers 51A, 51B, 61 in contact with the rotary electrode 1 peripheral face.
申请公布号 JP2001214275(A) 申请公布日期 2001.08.07
申请号 JP20000020715 申请日期 2000.01.28
申请人 TDK CORP;MORI YUZO 发明人 MOROOKA HISAO;YAMADA HIROSHI;MORI YUZO
分类号 C23C16/503;C23C16/505;C23F4/00;H01L21/205;(IPC1-7):C23C16/503 主分类号 C23C16/503
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