发明名称 |
Apparatus for manufacturing semiconductor device method for forming HSG-polysilicon layer using same and method for forming capacitor having electrode of HSG-polysilicon layer |
摘要 |
A semiconductor device manufacturing apparatus, an HSG-polysilicon layer forming method, and a method for forming a capacitor having the HSG-polysilicon layer as an electrode equilibrate the temperature of a processing chamber with a temperature close to that at which a semiconductor manufacturing process occurs. The semiconductor device manufacturing apparatus includes a wafer supporter for holding a wafer during the semiconductor manufacturing process. An elevator moves the wafer supporter vertically among a load/unload position, a standby position above the load/unload position, and a process position above the load/unload position. With this apparatus, processing uniformity is enhanced.
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申请公布号 |
US6271134(B1) |
申请公布日期 |
2001.08.07 |
申请号 |
US19980166223 |
申请日期 |
1998.10.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HA DAE-OH;LIM YONG-KYUN |
分类号 |
H01L21/28;H01L21/02;H01L21/205;H01L21/285;H01L21/677;H01L21/822;H01L21/8242;H01L27/04;H01L27/06;(IPC1-7):H01L21/44;H01L21/311 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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