| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having excellent heat resistance and insulating properties as a binding resin and further capable of achieving an improvement in electromagnetic characteristics as a metal mold part. SOLUTION: This epoxy resin composition comprises (a) an epoxy resin having <=500 g/equivalent epoxy equivalent, (b) an epoxy resin having >=800 g/equivalent epoxy equivalent and/or a phenol resin having >=500 g/equivalent hydroxyl group equivalent, (c) a curing agent, (d) a curing accelerator, (e) a powder of a metal or a metal compound and (f) a silane coupling agent.
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