发明名称 FLAME RETARDANT HIGH-PERMITTIVITY RESIN COMPOSITION, FLAME RETARDANT HIGH-PERMITTIVITY PREPREG AND FLAME RETARDANT HIGH-PERMITTIVITY LAMINATED SHEET
摘要 PROBLEM TO BE SOLVED: To obtain a flame retardant high-permittibity resin composition and a prepreg and a laminated sheet using the resin composition, especially a laminated sheet useful as a printed wiring board because the development of a high-permittivity laminated sheet satisfying the flame retardance UL94V-0 without containing a halogen substance and an antimony compound is not succeeded though the high-permittivity laminated sheet satisfying the flame retardance UL94V-0 without containing the halogen substance and antimony compound is demanded. SOLUTION: This flame retardant high-permittivity resin composition is characterized in that the resin composition consists essentially of (a) a resin having a dihydrobenzoxazine ring in the molecule, (b) a resin component composed of a compound exhibiting the reactivity with the dihydrobenzoxazine ring and a phenolic hydroxyl group produced by opening the ring of the dihydrobenzoxazine ring, (c) a high-permittivity inorganic powder and (d) a resin component or an inorganic powder composed of at least one or more kinds of an inorganic hydrate, a nitrogen-bases compound and a phosphorus-based compound and all the materials used have <=0.1 wt.% contents of the halogen and the antimony compound. The flame retardant high-permittivity prepreg is prepared by impregnating a substrate with the flame retardant high-permittivity resin composition and drying the resultant substrate. The flame retardant high-permittivity laminates sheet is obtained by hot-pressing the high-permittivity prepreg.
申请公布号 JP2001214029(A) 申请公布日期 2001.08.07
申请号 JP20000027231 申请日期 2000.01.31
申请人 HITACHI CHEM CO LTD 发明人 KAKIYA MINORU;OHORI KENICHI;NEGISHI HARUMI
分类号 C08J5/24;C08G14/073;C08K3/00;C08L61/34;C08L101/02;(IPC1-7):C08L61/34 主分类号 C08J5/24
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