| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor which contains neither a halogenide flame-retardant nor an antimony compound, and is excellent in moldability, flame-retardant property, high temperature storage property, moisture-proof, and soldering crack resistance. SOLUTION: The epoxy resin composition for encapsulating a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (C) a hardening promoter, (D) an inorganic filler, (E) a metal hydroxide solid solution as represented by general formula (1), and (D) zinc molybdate. Mg1-xM2+x(OH)2 (1) (In the formula, M2+ is at least one bivalent metal ion selected from the group consisting of Mn2+, Fe2+, Co2+, Ni2+, And Zn2+; and x is a number of 0.01<=x<=0.5).
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