| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing head in a wafer polishing device performing highly precise flattening without any influence of carrier face accuracy, thickness unevenness of a packing material or dust on a pressing face and the like while preventing a wafer from jumping out from the polishing head in polishing. SOLUTION: In the polishing head structure, an air blowout port is arranged on the lower face of a carrier 20, an upper outer circumference part 24 of the carrier is protruded in the radial direction, and a seal part 25 is formed by placing the upper outer circumference part onto a retainer ring 30. The retainer ring clamps the circumferential edge of a rubber sheet 60 while covering the carrier. In this way, an air chamber 61 is formed between the carrier lower face and the rubber sheet, and the wafer W is pressed onto an abrasive cloth 2 by means of the air chamber pressure. |
