PRINTER APPARATUS OF SOLDER BALL BUMPING SYSTEM FOR MANUFACTURING BALL GRID ARRAY SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A printer apparatus of a solder ball bumping system for manufacturing BGA(Ball Grid Array) semiconductor package is provided to improve the workability and productivity of a solder ball fusion splicing process by automatically coating a flux on a land provided on a PCB(Printed Circuit Board) of the BGA semiconductor package. CONSTITUTION: A plate(73) is located vertically. A cylinder(74A) for rising/falling a holder is parallel fixed on the plate(73). A blade and screen holder(74) rises and falls on a surface of the plate(74) by the cylinder(74A), has a screen patterned with plural holes(72A) on a bottom, and is provided with a guide rail(75A) on a side surface adjacent to the plate(74). A front of the blade and screen holder(74) is opened and a side thereof is a right-triangle shape. A blade holder(75) is fixed on the guide rail(75A) and includes a blade cylinder(71A) and a blade(71) for coating connected thereto. A front of the blade holder(75) is opened and a side thereof is a right triangle shape. A cylinder for transferring the blade holder(75) drives the blade holder(75) along the guide rail(75A) located on the rear of the guide rail(75A).