发明名称 |
MULTI-LAYER PRINTED WIRING BOARD, ITS PRODUCTION METHOD, AND METHOD FOR PRODUCING LAMINATED SHEET |
摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board in which each insulating layer formed from a prepreg has an approximately constant thickness. SOLUTION: In the printed wiring board in which different kinds of circuit substrates 2 are laminated through insulating layers formed from cured prepregs 1, two or more kinds of prepregs different in the amounts of a resin of glass cloth base materials whose difference in weight per unit area is 25% or below are used. The thickness of the insulating layer can be controlled precisely so that the thickness of the insulating layers formed from the prepregs 1 of different kinds are approximately constant. By using the glass cloth base materials, the dielectric constants of the insulating layers formed from the prepregs 1 of different kinds can be made approximately equal. |
申请公布号 |
JP2001212822(A) |
申请公布日期 |
2001.08.07 |
申请号 |
JP20000023368 |
申请日期 |
2000.01.31 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
MORI HIRONOBU |
分类号 |
H05K3/46;B29B11/16;(IPC1-7):B29B11/16 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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