发明名称 MULTI-LAYER PRINTED WIRING BOARD, ITS PRODUCTION METHOD, AND METHOD FOR PRODUCING LAMINATED SHEET
摘要 PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board in which each insulating layer formed from a prepreg has an approximately constant thickness. SOLUTION: In the printed wiring board in which different kinds of circuit substrates 2 are laminated through insulating layers formed from cured prepregs 1, two or more kinds of prepregs different in the amounts of a resin of glass cloth base materials whose difference in weight per unit area is 25% or below are used. The thickness of the insulating layer can be controlled precisely so that the thickness of the insulating layers formed from the prepregs 1 of different kinds are approximately constant. By using the glass cloth base materials, the dielectric constants of the insulating layers formed from the prepregs 1 of different kinds can be made approximately equal.
申请公布号 JP2001212822(A) 申请公布日期 2001.08.07
申请号 JP20000023368 申请日期 2000.01.31
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MORI HIRONOBU
分类号 H05K3/46;B29B11/16;(IPC1-7):B29B11/16 主分类号 H05K3/46
代理机构 代理人
主权项
地址