| 摘要 |
The invention provides multilayered polymethylpentene-containing release films, processes for making the same and for their use in preparing articles comprises cured fiber reinforced epoxy, phenolic or polyacrylate compositions which file use as aerospace structural elements. The films have improved release properties when exposed to high temperatures. The films are non-oriented and multilayered comprising a polyamide layer, a polymethylpentene layer and an adhesive interlayer therebetween. The a polyamide layer has a heat stabilizer; and polyamide blend composed of from about 30% to about 80% of a nylon 6 polymer having a number average molecular weight of at least about 40,000; from about 10% to about 30% of a nylon 6,66 copolymer having a number average molecular weight of at least about 15,000; and from about 5% to about 40% of a nylon 6,12 copolymer having a number average molecular weight of at least about 10,000. The a polymethylpentene layer has a heat stabilizer; and at least one polymethylpentene homopolymer, polymethylpentene containing copolymer or a blend thereof. The adhesive interlayer is attached between a surface of the polyamide layer and a surface of the polymethylpentene layer.
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