发明名称 SUBSTRATE ARRANGING METHOD IN VACUUM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a substrate arranging method in a vacuum deposition system capable of performing positioning to a substrate at high precision without using a positioning jip and arranging the same. SOLUTION: In this substrate arranging method in a vacuum deposition system, the positions of standard marks formed on a substrate are respectively measured, and positional information is obtained. Subsequently, after fine adjustment, the substrate is moved based on the positional information so as to be arranged at prescribed positions within a prescribed error, by which the preparation of the arrangement is performed. Next, with each standard mark as reference, the fine adjustment of the substrate is performed so as to be controller within a prescribed error, and the substrate is arranged. By arranging the substrate by using the same method, the arrangment with high precision can be performed without using a positioning jig.
申请公布号 JP2001214259(A) 申请公布日期 2001.08.07
申请号 JP20000022951 申请日期 2000.01.31
申请人 TOYOTA MOTOR CORP 发明人 TANAKA HIROTOMO
分类号 C23C14/24;C23C14/54;H01L21/203;(IPC1-7):C23C14/24;//H01L21/2 主分类号 C23C14/24
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