| 摘要 |
PROBLEM TO BE SOLVED: To enhance cleaning effects in a cleaning device for removing particles such as polishing refuse attached to the top and bottom sides of a substrate, after it is subjected to a treatment such as CMP treatment. SOLUTION: In the substrate treatment device 100 for cleaning a wafer W, the substrate W is successively transported to a plurality of treatment parts 30, 40, 50 for cleaning the wafer W, which wafer W is CMP-processed by a CMP device 200. In the treatment part 30, holding rollers 80a, 80b, 80c and a periphery cleaning means 90 are disposed on a main body 39 of a holding hand 35a. The wafer W is held by a holding hand 35b similar to the hand 35a, while the means 90 is positioned at a cleaning point. The periphery of the wafer W is cleaned in such a manner that bristles of a brush of a cleaning tool 91 are moved from above the periphery so as to slide over a flat surface portion and an end surface portion of the periphery, so that both the portions are rubbed.
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