Method of manufacturing semiconductor device which can reduce manufacturing cost without dropping performance of logic mixed DRAM

摘要

A method of manufacturing a semiconductor device, includes a providing step, a forming step, and a removing step. The providing step includes providing a DRAM section and a logic section in a substrate. The forming step includes forming a first silicide layer in the DRAM section and a second silicide layer in the logic section. The removing step includes removing the first silicide layer.