发明名称 |
Method for improving adhesion to copper |
摘要 |
Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium bitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.
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申请公布号 |
US6271595(B1) |
申请公布日期 |
2001.08.07 |
申请号 |
US19990231618 |
申请日期 |
1999.01.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MCGAHAY VINCENT J.;IVERS THOMAS H.;LIU JOYCE C.;NYE, III HENRY A. |
分类号 |
H01L21/3205;H01L21/28;H01L21/768;H01L23/52;H01L23/532;(IPC1-7):H01L21/328;H01L21/479 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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