发明名称 RESIN COMPOSITION AND USE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in molding processability, gloss, flexibility and abrasion resistance, and to provide molded products and laminates each using the above resin composition. SOLUTION: This resin composition comprises (A) a thermoplastic resin, (B) an ethylene-vinyl acetate copolymer 40-65 wt.% in vinyl acetate content, 0.05-250 g/10 min in melt index(MI) (190 deg.C, 2,160 g load), <10 wt.% in acetonitrile solubles, and >=150,000 in weight-average molecular weight or >=3 wt.% in insolubles to benzene, and (C) an inorganic filler. The other objective molded products and laminates each using the above resin composition are provided.
申请公布号 JP2001214071(A) 申请公布日期 2001.08.07
申请号 JP20000027514 申请日期 2000.02.04
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 IZUMI KOJI
分类号 B32B27/28;C08K3/00;C08K3/22;C08L23/04;C08L31/04;C08L97/02;C08L101/00;(IPC1-7):C08L101/00 主分类号 B32B27/28
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