发明名称 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
摘要 A heat sink substrate comprises a Cu-Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu-Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.
申请公布号 US6271585(B1) 申请公布日期 2001.08.07
申请号 US19980110669 申请日期 1998.07.07
申请人 TOKYO TUNGSTEN CO., LTD. 发明人 OSADA MITSUO;ICHIDA AKIRA;HIRAYAMA NORIO;ASAI KIYOSHI;MAESATO HIDETOSHI;ARIKAWA TADASHI
分类号 C22C1/04;H01L21/48;H01L23/373;H05K1/03;H05K3/10;(IPC1-7):H01L23/34 主分类号 C22C1/04
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