发明名称 |
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same |
摘要 |
A heat sink substrate comprises a Cu-Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu-Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.
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申请公布号 |
US6271585(B1) |
申请公布日期 |
2001.08.07 |
申请号 |
US19980110669 |
申请日期 |
1998.07.07 |
申请人 |
TOKYO TUNGSTEN CO., LTD. |
发明人 |
OSADA MITSUO;ICHIDA AKIRA;HIRAYAMA NORIO;ASAI KIYOSHI;MAESATO HIDETOSHI;ARIKAWA TADASHI |
分类号 |
C22C1/04;H01L21/48;H01L23/373;H05K1/03;H05K3/10;(IPC1-7):H01L23/34 |
主分类号 |
C22C1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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