发明名称 Method of manufacturing flash memory
摘要 A method of manufacturing a flash memory having a dual floating gate structure. A source/drain region is formed in a substrate. A first conductive layer is formed on the substrate and between the source/drain region. A first dielectric layer is located between the substrate and the first conductive layer. A floating gate mask is formed on the substrate and the first conductive layer to expose a portion of the first conductive layer. The portion of the first conductive layer and a portion of the first dielectric layer beneath the exposed conductive layer are removed. The floating gate mask is removed. A conformal second dielectric layer and a second conductive layer are formed over the substrate in sequence. The second conductive layer and the second dielectric layer are formed to respectively form a control gate and a third dielectric layer.
申请公布号 US6271089(B1) 申请公布日期 2001.08.07
申请号 US19990433955 申请日期 1999.11.04
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHEN WAY-MING;CHANG RICHARD
分类号 H01L21/28;H01L21/336;H01L29/788;(IPC1-7):H01L21/824 主分类号 H01L21/28
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