| 摘要 |
PROBLEM TO BE SOLVED: To excellently flatten and polish whole the metallic film with a proper load while preventing the metallic film from peeling off. SOLUTION: The back face of a base board 2, on which the metallic film 3 is formed, is sucked and held onto a suction face 1a in a rotating circular suction jig 1, and the metallic film 3a is covered with a protective film 4 with a polishing rate lower than that of the metallic film. The protective film 4 is evenly ground, and when a part of the metallic film 3 is exposed from the protective film 4, polishing is carried out with an eccentric load impressed onto the protective film 4 side, and when most of the metallic film 3 is exposed, this impression is removed and the metallic film is polished to a predetermined thickness.
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