| 摘要 |
A heat sink device for a chip comprises a heat sink, a pair of mounting portions and a pair of fixing bolts. The heat sink includes a base, a plurality of fins and a pair of tabs symmetrically extending from opposite corners thereof and having a hole. Each mounting portion includes a main body, a resilient arm upwardly and inwardly extending from an end of the main body and a pair of clamping portions extending from the edges of the main body. Apertures defined in the main bodies and openings defined in the resilient arms correspond to the holes of the tabs. Each fixing bolt includes a cap, a beam, a latch and a step.
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