发明名称 |
Method of making thermally removable polymeric encapsulants |
摘要 |
A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90° C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.
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申请公布号 |
US6271335(B1) |
申请公布日期 |
2001.08.07 |
申请号 |
US20000484838 |
申请日期 |
2000.01.18 |
申请人 |
SANDIA CORPORATION |
发明人 |
SMALL JAMES H.;LOY DOUGLAS A.;WHEELER DAVID R.;MCELHANON JAMES R.;SAUNDERS RANDALL S. |
分类号 |
C08F283/00;C08G61/12;C08G73/00;(IPC1-7):C08G73/00;B29B13/00 |
主分类号 |
C08F283/00 |
代理机构 |
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