| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card capable of drastically reducing a manufacturing cost in comparison with the conventional manner. SOLUTION: This IC card is provided with a supporting body 1 made of thermoplastic resin having heat fusion property, metallic foil 2b connected at least to one surface of the body 1 by heat without the intervention of an adhesive, an electronic part 6 electrically connected to the metallic foil and at least one layer 10 to be covered laminated on the supporting body so as to cover the electronic part. |
