METHOD OF MANUFACTURING SEMICONDUCTOR WAFER WITH ANISOTROPIC CONDUCTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor wafer with an anisotropic conductive film kept at high quality. SOLUTION: An anisotropic conductive film (ACF) 2 is superposed on the circuit surface and/or the rear of a semiconductor wafer 1, leaving the outer peripheral edge of the wafer 1 exposed as a margin 1s so as to be pasted up. Furthermore, a releasable adhesive film 3 is superposed covering ACF 2, and the margin 1s, the wafer 1, the ACF 2, and the adhesive film 3 are pasted together and thermocompressed, to bond the semiconductor wafer 1 and the ACF together for the formation of a semiconductor wafer with an ACF. A releasable adhesive film can be also used in common as a dicing adhesive film.