| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the chucking mechanism of a prober that can inspect a semiconductor device by accurately and quickly setting the temperature to the use environment temperature of the device. SOLUTION: The chucking mechanism 2 of the prober has a chucking unit 21 that holds wafer, where the surface of the chuck unit is divided into a plurality of regions. Each region has an independent heating/cooling mechanism 23 and a temperature sensor 24. The temperature in each region is managed, by receiving the result of the detection by the sensor in the region and controlling the heating/cooling mechanism in the region. Consequently, the temperature of the semiconductor device under measurement can be set accurately.</p> |
