| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip package which is simple-structured and can radiate heat efficiently and has a stable heat radiation characteristic, and also provide an easy method of manufacturing the same, which is suitable for mass-production. SOLUTION: A semiconductor bare chip 3 is connected and mounted on an insulation substrate 1 by means of bump electrodes 4. The semiconductor bare chip 3 is covered with a metal plate 7. The metal plate 7 is bonded on the opposite face of the substrate on which the chip 3 is connected 1, by means of adhesives 8, 9. The metal plate 7 has such a shape as to have, at least in one end, a bent part 7b to coat an end face of the substrate 1. The bonding between the metal plate 7 and the semiconductor bare chip 3 at a contact face by means of the adhesive 8, the bonding between the metal plate 7 and the chip 3 at a non-contact face by means of the adhesive 9, and the bonding between the metal plate 7 and the substrate 1 by means of an adhesive 11 are executed in one and the same process. |
