| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module exhibiting high heat dissipation effect through simple structure. SOLUTION: The semiconductor module comprises a circuit board 1, a plurality of semiconductor components 2 mounted in array on the circuit board, and a plurality heat spreaders 30-32 corresponding to the plurality of semiconductor parts 2, respectively. The plurality heat spreaders touch the plurality of corresponding semiconductors 2, respectively, adjacent heat spreaders are connected in array and the heat spreaders 31, 32 located at the opposite end parts of the array are secured to the circuit board. |
