| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a producing method for the same, with which reliability is high, man-hour are reduced and yield can be improved. SOLUTION: A wiring board 1 is provided with a substrate 3, which is almost plate-shaped while having a principal surface 3A and a backside 3B on the center, laminating a resin insulating layer on a core substrate 9. On this substrate 3, an almost cylindrical inner through-hole 31 is formed passing through the principal surface 3A and the backside 3B. Inside this inner through hole 31, an almost columnar central through conductor 33 is formed by filling the inside with plating. |
