| 摘要 |
PROBLEM TO BE SOLVED: To smoothen the surface of an insulating layer resin with high efficiency. SOLUTION: The insulating layer resin is held on an intermediate plate, capable of absorbing ruggedness on the surface, adsorbing/holding the surface and rotating around a pressurizing axis via an elastic adsorbing body and in this state, the non-adsorbed surface of the insulating layer resin is pressed to a polishing pad stuck to a rotary board, while feeding a polishing liquid containing fine abrasive grains so that the ruggedness on the surface of the insulating layer resin can be removed, and when there is a cured layer on the surface, the surface is polished until the cured layer is removed as well. When forming wirings on both sides, the backside is polished by applying the same process as well. Next, after this polished surface is made coarse by an alkali solution, a plating catalysis is stuck and further, a plating resist is applied/ patterned thereon. Afterwards, a signal wiring layer is formed by applying plating. |
