| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can effectively prevent the occurrence of migration. SOLUTION: This wiring board is constituted by arranging a plurality of wiring conductors 2 containing silver, aluminum, or an alloy of these metals in parallel with each other at intervals of 10-100 μm on a substrate 1 and, at the same time, commonly covering the conductors 2 with a resin-made protective layer 3. The protective layer 3 contains 5.0-60.0 vol.% bubbles 4 having diameters of 0.5-5.0 μm in at least the areas among adjacent conductors 2, in such a way that the number of distributed bubbles 4 is made larger on the substrate 1 side than the surface side. |
