| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency semiconductor device which realizes the multi-chip mounting intended to reduce the number of parts and miniaturize the device and has good high frequency characteristics at a low manufacturing cost. SOLUTION: The high frequency semiconductor device is such that a plurality of mounting parts with electrode wirings 111-113, 121-123 to which electrodes of a plurality of high frequency circuit elements are electrically connected is provided on the upside of a dielectric board 1, high frequency semiconductor circuit elements 41, 42 are mounted on each mounting part to electrically connect their electrodes to the electrode wirings 111-113, 121-123, a dielectric cover 2 having a plurality of recesses 31, 32 corresponding to the mounting parts on the downside and connection wirings 201-203 formed between the recesses 31, 32 is mounted on the dielectric board 1 to house the high frequency semiconductor elements 41, 42 in the recesses 31, 32 every mounting part, and the electrode wirings 111-113, 121-123 between the mounting parts are mutually electrically connected through the connection wirings 201-203. |
