| 摘要 |
<p>PROBLEM TO BE SOLVED: To reproducibly transfer fine solder balls concerning the manufacturing method for solder bumps. SOLUTION: A flat plate 1 consisting of single crystal is provided with a recess 2, all the side walls 3 of which are constituted from crystallographically equivalent crystal faces and the opening of which is hexagonal, and then solder paste is filled into this recess 2 and heat-treated, thereby forming a solder ball 5.</p> |
