PRODUCING METHOD FOR DOUBLE-FACED WIRING BOARD WITH BUILT-IN COMPONENT AND ELECTRONIC CIRCUIT STRUCTURE

摘要

PROBLEM TO BE SOLVED: To solve the problem of limits in miniaturization, high-density packaging and multifunctioning concerning a wiring board with built-in electronic components. SOLUTION: A semiconductor chip 6 is packaged on the upper surface of a multilayer wiring board 5, having multiple insulating substrates 1, inner layer wiring 2, wiring 3 formed on both sides and via hole conductor 4 for electrically connecting these wiring groups as principal components, electronic components such as chip resistor 10, chip capacitor 11 and chip coil 12 are built in the other via hole, these electronic components are located especially directly under the semiconductor chip 6, and the electronic components are serially connected through the inner layer wiring 2.