| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus and method which uses a vacuum suction means as the means for fixing a work of the object of plasma treatment. SOLUTION: An upper electrode 2 and a lower electrode 3 are provided in a vacuum chamber 1. A suction hole 17 in the lower electrode 3 is evacuated by a first pump 21, and a work is fixed on the lower electrode 3. Then the vacuum chamber 1 is evacuated by a second vacuum pump 26, and a plasma generation gas is supplied to execute plasma treatment, while maintaining the vacuum pressure of the vacuum chamber 1 within a range of plasma treatment pressure. When plasma treatment has finished, the supply of the plasma generation gas is stopped, and first the vacuum chamber 1 should be returned to atmospheric pressure, and secondly, the absorbing hole 17 should is returned to the atmospheric pressure. |
