| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of and an apparatus for wafer alignment that operate, without having to increase the transfer period of a wafer, while the wafer is being transferred. SOLUTION: Dynamic alignment of a wafer, which uses a support blade for transferring the wafer, is provided by determining the approximate value of an offset of the wafer, with respect to a desirable position of the wafer is a module. The determination is, in terms of the statement of an optimization program for effectively keeping an offset computation time period within a wafer transfer time period. According to this method, and by programming a computer, the wafer is picked up using an end effector from a first location, so that the end effector is moved to transfer the picked up wafer from the first location past a set of sensors to produce sensor data.</p> |
