发明名称 METHOD OF MANUFACTURING EIFLD EFFECT TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To provide the simple manufacturing method of the field effect transistor(FET) of a short gate, which uses a compound semiconductor. SOLUTION: An active layer 2 and a contact layer 3 of a first conductive compound semiconductor layer are eptaxially grown sequentially on the substrate 1 of semi-insulation property, which is formed of a compound semiconductor material. Then, a recess 4 is formed. A surface-reforming layer 5 is formed on the surface of the active layer 2 and the contact layer 3. The surface- reforming layer 5 is opened by an electron beam 12. A lower gate electrode 7 is selectively grown in an opening part 6, in a columnar shape with the surface reforming layer 5 as a mask. An insulating film 13 is deposited and planarized. The upper end of the lower gate electrode 7 is exposed. An upper gate electrode 8 connected to the upper end is formed, and an opening extending to the contact layer 3 is formed in the insulating film 13. An ohmic electrode is formed in an opening part 10, and FET is manufactured.
申请公布号 JP2001210658(A) 申请公布日期 2001.08.03
申请号 JP20000016887 申请日期 2000.01.26
申请人 NEC CORP 发明人 MIYOSHI YOSUKE
分类号 H01L29/812;H01L21/28;H01L21/338;(IPC1-7):H01L21/338 主分类号 H01L29/812
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