PURPOSE: A stack package is provided to keep up with a small sized and thin semiconductor product by manufacturing a unit package to a semiconductor chip thickness. CONSTITUTION: Two unit packages(10) are stacked in three dimension. A semiconductor chip has a plurality of electrode pads on an active surface. A conductive pattern is connected to the electrode pads on one end thereof and extended to an outside of the semiconductor chip on the other end thereof. An insulation layer is formed on other portions on the active surface where the electrode pad is formed and has flexibility. Metal bumps(18) are formed on the electrode pads. An electrical connection between the unit packages(10) is enabled by connecting the metal bumps. A conductive pattern including the insulation film which is drawn out to the outside of the semiconductor chip of the stack packages is downwardly curved and connected to a conductive pattern of the unit stack package on the lower part. The conductive pattern including the curved insulation film of the unit stack package on the lowest layer is used as an external connection terminal(19).
