| 摘要 |
PURPOSE: A method for measuring a semiconductor device is provided to drastically improve productivity by reducing a measuring time in a semiconductor manufacturing process. CONSTITUTION: A wafer(W1) within the first cassette(10) is loaded to a pre-align part(12) by a moving unit(14) to make flat zones possible to be aligned. The wafer(W1) is fixed to a chuck part(13) for a predetermined measurement. While the wafer(W1) is measured in the chuck part(13), the moving unit(14) is continuously operated to load a wafer(W2) within the second cassette(11) and align flat zones. After the predetermined measurement is completed in the chuck part(13), the moving unit(14) is operated to unload the wafer(W1) to an inside of the first cassette(10), The wafer(W2) on the pre-align part(12) is moved to the chuck part(13) and fixed for a predetermined measurement. While the wafer(W2) within the second cassette(11) is measured, the moving unit(14) is continuously operated, picks up the wafer(W1) within the first cassette(10), loads the same on the pre-align part(12) and aligns the flat zones. After the measurement of the wafer(W2) within the second cassette(11) is completed, the moving unit(14) is operated to unloads the wafer(W2) within the second cassette(11).
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