| 摘要 |
PROBLEM TO BE SOLVED: To reduce percent defectives of soldering due to blow holes. SOLUTION: A groove 1 is formed in a resin injecting port of a mold case 11. Accordingly, the liquid surface 13a of an injected epoxy resin 13 is swollen from two positions opposed to each other of a lower surface 12a of the groove 12 towards middle positions. When casting mold is conducted in this way, a protrusion composed of a swollen portion is formed in the outer peripheral edge of the lower surface of an LED lamp. Accordingly, when the LED lamp is directly attached to a substrate, the protrusion is brought into contact with the substrate surface, and the resin swollen portion at the base of a lead element seals a hole in the substrate completely. As a result, an air escape is secured and a percent defective of soldering due to blow holes is substantially reduced. |
