发明名称 METHOD FOR EXPOSING SUBSTRATE AND ALIGNER
摘要 PROBLEM TO BE SOLVED: To provide a substrate exposing method and an aligner by which the warpage and wrinkles or the like of a film-like substrate such as a multi- layer substrate placed on the upper face of a lower frame are eliminated and alignment work with a mask film stuck and fixed at an upper frame is easily and surely performed. SOLUTION: Before the film-like substrate W placed on the upper face 102 of the lower frame 100 by a handler 300 is sucked and fixed by a vacuum sucking device 120, it is pressed by the upper frame 200 on the lower face 202 of which mask film M is stuck and fixed, and is flattened on the upper face 102 of the lower frame 100 by eliminating the warpage and the wrinkles of the film-like substrate W. Then, it is sucked and fixed on the upper face 102 of the lower fame 100 of the substrate W by evacuating by the vacuum sucking device 120, and the alignment with the mask film M is confirmed, so that exposure is performed by irradiating with ultraviolet rays from an exposure light source.
申请公布号 JP2001209192(A) 申请公布日期 2001.08.03
申请号 JP20000014896 申请日期 2000.01.24
申请人 ORC MFG CO LTD 发明人 AOKI TOSHIHIRO;ISE MASARU
分类号 H05K3/00;G03F9/00;H01L21/027;(IPC1-7):G03F9/00 主分类号 H05K3/00
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