发明名称 MANUFACTURE OF DAMPER AND SPEAKER UNIT USING THE DAMPER
摘要 PROBLEM TO BE SOLVED: To improve workability in the case of forming a lead wire on a small diameter resin damper. SOLUTION: The lead wire including at least a tinsel wire 13 is mounted in the injection molding metallic molds 17 and 18 of the damper, the injection molding metal mold is closed and resin 19 is injected, when the resin 19 is cured, the resin 19 is extracted from the metal mold, and the tinsel wire over the opening 10 of a metal mold inner circumference where a voice coil bobbin is mounted is cut off and connected to an external lead-through terminal 16. Both external lead-through terminals connected to the tinsel wire may be mounted besides the wire 13. Also, as one of method for mounting the tinsel wire, may be pasted or printed onto an insulating sheet of a flexible film, etc., and be mounted.
申请公布号 JP2001211499(A) 申请公布日期 2001.08.03
申请号 JP20000015789 申请日期 2000.01.25
申请人 PIONEER ELECTRONIC CORP;MOGAMI DENKI CORP 发明人 TAKAHASHI MASANORI;NAKAGAWA MASARU;SHIMIZU KIYOYA
分类号 H04R9/04;H04R31/00;(IPC1-7):H04R9/04 主分类号 H04R9/04
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