| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing photosensitive glass paste which can suppress shrinks in sintering, dispersion of conductor components including Ag, and gelation, and can surely forming, for example, a glass layer with via holes having predetermined precise shape and dimensions disposed at the predetermined positions and a multiplayer wiring circuit board using this paste. SOLUTION: As a glass component to constitute the principal part of the inorganic composition of a photosensitive glass paste, a mixture of glass components of low and high melting points is employed, and the mixing ratio of is made larger for the glass components of high melting point (70 to 99% by weight) and smaller for the low melting point glass (1 to 30% by weight). For the high melting point glass, a borate silicate glass is used which can suppress dispersion of conductive component including Ag. The ratio of the inorganic component in the photosensitive glass component is made between 40 to 70% by weight. |
