| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring component for an electronic component package, which allows a free layout of wiring circuit. SOLUTION: The wiring component is made by first forming through holes 20 in an insulation sphere 10, then forming first conductor columns 30 made of plated metal in the through holes 20, and then forming electrodes 40 made of plated metal connected to the first conductor columns 30 on the surface of the sphere 10 at the opening ends of each through hole 20 and around the opening ends. A plurality of such wiring components are arranged nearly in plane, and the electrodes 40 of the adjacent components are connected to each other to form a combined body. Two or more of such combined bodies are laid on top of each other and the electrodes 40 of the adjacent combined bodies are connected to each other to form an electronic component package, wherein the combination of those wiring components can be easily changed.
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