| 摘要 |
PROBLEM TO BE SOLVED: To improve the method of mounting a substrate in a holder on a carrier, without having to change the operating speed of a robot, to increase the substrate transfer quantity per unit time, and to improve the processing ability of a substrate processor. SOLUTION: The substrate transfer apparatus is applied to e.g. an inline type film forming apparatus. The substrate transfer apparatus has a subsidiary vacuum chamber 17 and a vacuum chamber 16, the subsidiary vacuum chamber 17 has a plurality of first substrate cassettes, the vacuum chamber 16 communicates with a vacuum chamber 10c with a carrier moving along a transfer passage, and the vacuum chamber 16 has robots 25, 26. And a plurality of second substrate cassettes which are disposed between these robots, capable of mounting a plurality of substrates and arranged in parallel. A substrate 116 is a discoidal substrate having a center hole, and the center hole of the substrate is used as a hook in a pickup operation. |
