| 摘要 |
PROBLEM TO BE SOLVED: To provide a side emission type light-emitting diode by suppressing a manufacturing cost and dispersion of a luminescent color. SOLUTION: This side emission diode is provided with a laminate substrate on which a first substrate 21, a second substrate 22, and a third substrate 23 are laminated; a light-emitting element chip 1 mounted in this laminate substrate; and a resin 4 that covers the circumference of this light-emitting element chip 1. A color conversion material layer 3 is provided in a location opposed to the light-emitting element chip 1 of the second substrate 22 that surrounds the side of the light-emitting element chip 1, and the light having a wavelength component in which the wavelength of fight of which the light from the light- emitting element chip 1 is converted by the color conversion material layer 3 and the wavelength of the light from the light-emitting chip 1 are mixed is projected. |
