发明名称 METHOD OF FORMING CONDUCTOR PATTERN, WIRING MEMBER MANUFACTURED THEREBY, CONNECTOR, FLEXIBLE PRINTED WIRING BOARD, AND ANISOTROPIC CONDUCTIVE MEMBER
摘要 <p>PROBLEM TO BE SOLVED: To provide a method by which a conductor pattern can be formed easily on a pressure-sensitive adhesive or adhesive, and the pressure-sensitive adhesive or adhesive is made to be usable for various uses as a mechanical coupling means. SOLUTION: In this method, the conductor pattern 18 is formed in such a way that a metallic thin film 15 is formed on a die 11 having protrusions 12 formed correspondingly to a conductor pattern to be formed. The thin film 15 formed on the protrusions 12 is transferred to the pressure-sensitive adhesive (adhesive) 16 applied to one surface of a substrate 17, by closely adhering the surface of the substrate 17 carrying the adhesive 16 to the thin film 15 formed on the protrusions 12 and pulling up the substrate 17.</p>
申请公布号 JP2001210933(A) 申请公布日期 2001.08.03
申请号 JP20000243950 申请日期 2000.08.11
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 OGUCHI CHIKAO;TAI TOMISHIGE
分类号 H01R11/01;H01B5/14;H01B5/16;H01B13/00;H01R43/00;H05K1/14;H05K3/20;H05K3/40;(IPC1-7):H05K3/20;H01R12/06;H01R12/08 主分类号 H01R11/01
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