发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem of high on-resistance that can not be lowered by the enlarging of a connection area with a lead or a conductive foil if the surface of an electrode is oxidized. SOLUTION: A semiconductor pellet has first and second electrodes in which main electric current is carried in or out on both faces thereof. The first electrode is connected electrically to an island and mounted. The second electrode and the lead are connected electrically via the conductive foil in the semiconductor device. A projected part, made of conductive material capable of plastic deformation under pressure, is provided in the position of the conductive foil opposite to the second electrode. The circumferential face of the projected part is swelled so that the second electrode and the conductive foil are connected electrically.
申请公布号 JP2001210671(A) 申请公布日期 2001.08.03
申请号 JP20000024677 申请日期 2000.01.28
申请人 NEC KANSAI LTD 发明人 UCHIYAMA NORIHIRO
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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