发明名称 COMPOSITION FOR REMOVING THERMO-CURING RESIN
摘要 PURPOSE: A composition for removing thermo-curing resin is provided to impart good workability to remove such as dielectric layer, organic protective layer, insulating layer, oriented film, black matrix or color filter by comprising tetramethyl ammonium hydroxide ( TMAH"). CONSTITUTION: The composition comprises TMAH, cabitor such as D(Ethyleneglycol) ethylether and water a weight ratio of 10:50:40 % by weight based on total 100 weight of composition. The composition is applied to the subject material by means of an apparatus comprising a dipping device(12) and a washing device worked by physical and mechanical operation. The composition is holding in the dipping device(12). The dipping device is supplied with a substrate(10) having some troubles to be removed. The substrate dips into the composition for desired time then is under the stripping process by the physical and mechanical device(14) and dipping process to completely remove the residual of the thermo-curing resin.
申请公布号 KR20010073931(A) 申请公布日期 2001.08.03
申请号 KR20000003127 申请日期 2000.01.22
申请人 LG.PHILIPS LCD CO., LTD. 发明人 RYU, GI HYEON
分类号 C09K3/00;H01L21/00;(IPC1-7):C09K3/00 主分类号 C09K3/00
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